DFM / DFA Services

We perform DFM/DFA based on the following parameters and also provide procurement and/or mounting services as required.

PCB DFM / DFA Services

Our Process

DFM SERVICES

Drill Checks
  • Hole Size.
  • Hole Separation.
  • Missing Holes.
  • Power/Ground shorts.
  • NPTH to Route.
  • Stubbed vias.
  • Thermal Connection.
Signal and Mixed Layer Checks
  • Spacing violation checks.
  • Dill distance violation checks.
  • Route distance violation checks.
  • Reports size of pads, shared lines, text, line neckdowns, arcs and shaved arcs.
  • Reports on silvers between lines and pads.
  • Reports on unconnected line endpoints.
Power and Ground Checks
  • Drill – Reports distance violation between NPTHs/PTHs/Vias to plane, copper, clearance and annular rings.
  • Silver – Reports slivers in negative and positive layers.
  • Route – Reports close spacing between copper/clearance and route features.
  • Thermal – Reports spoke (tie) widths and reduction of connectivity of thermal pads.
  • NFP Spacing – Reports spacing between NFPs and NFPs, NFPs and planes.
  • Plane Spacing – Reports spacing between features of different planes.
  • Keepin/Keepout areas – Reports features inside/outside Keepin/Keepout areas.
  • Plane Width – Reports insufficient width of copper between 2 drills connected to a copper plane.
  • Plane Connection – Reports disconnected areas of copper often used as reference planes that are left in a design could cause an unreferenced critical net, or a missing electrical connection.
Solder Mask Checks
  • Drill – Reports close distance to solder mask openings of PTH/NPTH annular rings, and where NPTH touches mask.
  • Pads – Reports close distance to solder mask openings of all pads, including undrilled pads. It also reports on a special group, Gaskets, which reports the width of solder mask overlap on features.
  • Coverage – Reports lines too close to clearance (that is, not adequately covered).
  • Route – Reports close distance between solder mask and route features.
  • Bridge – Reports different net pads without solder mask bridges.
  • Silver – Reports slivers between solder mask clearance.
  • Missing – Reports missing clearances.
  • Spacing – Reports close spacing between clearance (wider than silver).
  • Extra – Reports solder mask features which lack copper pads, or do not intersect with copper.
Silk Screen Checks
  • Solder mask clearance – Reports close distances between silkscreen features and solder mask clearance.
  • SMD clearance – Reports close distances between silkscreen features and SMD pads.
  • Pad clearance – Reports close distances between silkscreen features and pads.
  • Hole clearance – Reports close distances between silkscreen features and drills.
  • Route clearance – Reports close distances between silkscreen features and route features.
  • Line width – Reports line width violations and length to width ratio violations.
  • String overlap – Reports the touching or intersection of silkscreen features of various string value.

DFA SERVICES

DFA is a technique which will minimize the Assembly time & process. A customer has a right to expect the product to be delivered without defects & time as promised. Every occurrence of a defect within the Assembly process requires time to analyse, repair, and test.

Optimizing Fabrication Process
  • A defect is any variation of a required characteristic of the product or its parts, which is far enough removed from its target value to prevent the product from fulfilling the physical and functional requirements of the customer a. A defect is any variation of a required characteristic of the product or its parts, which is far enough removed from its target value to prevent the product from fulfilling the physical and functional requirements of the customer 
BOM Verification
  • Determine the quantity between practical part count& Bill of material (BOM) parts count.a. Determine the quantity between practical part count& Bill of material (BOM) parts count.
Mistake Proofing
  • Ensure component foot prints and pads isusually specified in the Printed Circuit Board Design& purchased parts land pattern is matching or not (mistake proofing).
Component foot print checks
  • Ensure component foot prints and pads are followed as per IPC specification. So that part can be easily mounted while Assembly.a. Ensure component foot prints and pads are followed as per IPC specification. So that part can be easily mounted while Assembly.
Hole and Component Checks
  • The printed board hole diameter of a through-hole & the datasheet hole diameter should match.
  • Ensure the distance between the component to component spacing.
  • The distance from a component body to the edgeof a printed board.
  • Spacing between components for reflows and wave soldering.
  • Ensure Pin1 indication, Cathode & connector orientations are provided.
  • Ensure paste layer provided for the all the SMD pads for stencil requirement unless customer eliminated for specific parts.

12 + 9 =

Address

1st Floor, H.I.G.A. 10, H.No.1-19-16
ECIL, Gokul Nagar, Dr. AS Rao Nagar
Secunderabad – 500062
Telangana, India

Phone

+91 812 599 1840

Email

sales@turnkey-pcb.com

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